Applied Materials’ Innovative Pattern-Shaping Technology Reduces the Cost, Complexity and Environmental Impact of Advanced Chip Manufacturing
- The new Centura® Sculpta® patterning system provides a simpler, faster and more cost-effective alternative to EUV double patterning
Customers increasingly use EUV double patterning to print chip features smaller than the resolution limits of EUV to optimize chip area and cost. Using EUV double patterning, chipmakers split a high-density pattern in half and produce two masks that adhere to the resolution limits of EUV. Both halves of the pattern are combined on intermediate patterning films and then etched into the wafer. While double patterning is effective at increasing feature density, it adds design and patterning complexity along with process steps that consume time, energy, materials and water – and increase the cost of wafer fabs and wafer production.
Introducing the Applied Materials Centura® Sculpta® Patterning System
To help chipmakers continue shrinking designs without the added cost, complexity, and energy and materials consumption of EUV double patterning,
EUV double patterning requires a number of added manufacturing process steps that generally include CVD patterning film deposition, CMP cleaning, photoresist deposition and removal, EUV lithography, eBeam metrology, patterning film etching and wafer cleaning. For each EUV double patterning sequence it replaces, the Sculpta system can provide chipmakers with:
- Capital cost savings of approximately
$250 millionper 100K wafer starts per month of production capacity
- Manufacturing cost savings of approximately
- Energy savings of more than 15 kwh per wafer
- Direct greenhouse gas emissions reduction of more than 0.35 kg of CO2 equivalent per wafer
- Water savings of approximately 15 liters per wafer
“The new Sculpta system is a great example of how advances in materials engineering can complement EUV lithography to help chipmakers optimize chip area and cost while also tackling the growing economic and environmental challenges of advanced chipmaking,” said Dr. Prabu Raja, Senior Vice President and General Manager of the Semiconductor Products Group at Applied Materials. “The Sculpta system’s unique pattern-shaping technology combines Applied’s deep expertise in ribbon-beam and materials removal technologies to create a breakthrough innovation for the patterning engineer’s toolkit.”
Customer and Industry Comments
“As Moore’s Law drives us to ever-greater compute performance and density, pattern shaping is proving to be an important new technology that can help reduce manufacturing cost and process complexity, and conserve energy and resources,” said
“Three critical issues must be considered when pushing the limits of patterning: tip-to-tip spacing, pattern bridge defects and line edge roughness,” said
“Applied Materials’ new Sculpta system is a revolution in patterning that brings an entirely new capability to chipmakers,” said
The Sculpta system is receiving high interest from leading chipmakers and has been selected as a production tool of record for multiple steps in high-volume logic manufacturing.
Additional information about Applied’s Sculpta system will be discussed at the company’s “New Ways to Shrink: Advanced Patterning Products Launch” event being held today.
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Applied Materials Centura® Sculpta® Patterning System
The new Centura® Sculpta® patterning system reduces EUV double-patterning steps to lower the cost, complexity and environmental impact of leading-edge chipmaking.
Pattern-shaping technology: a breakthrough innovation for the patterning engineer's toolkit.
Applied Materials’ pattern-shaping technology brings an entirely new capability to chipmakers, enabling them to replace EUV double-patterning steps and reduce the cost, complexity and environmental impact of leading-edge chipmaking.
Source: Applied Materials, Inc.