Events

Events

Upcoming Events Recent Events Master Classes Investor Day

Dec 3, 2024

UBS Global Technology Conference

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Dec 4, 2024

Wells Fargo TMT Summit

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Dec 10, 2024

Applied Materials Panel Discussion during IEDM 2024

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Nov 14, 2024

Q4 2024 Applied Materials Earnings Conference Call

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News Release 251.3 KB

Non-GAAP Reconciliation 279.9 KB

Sep 11, 2024

Goldman Sachs Communacopia + Technology Conference

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Sep 4, 2024

Citi 2024 Global TMT Conference

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Aug 15, 2024

Q3 2024 Applied Materials Earnings Conference Call

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News Release 239.7 KB

Non-GAAP Reconciliation 280 KB

Jul 9, 2024

2024 SEMICON West Technology Breakfast

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Presentation: Applied Materials 9.6 MB

Key Points: Applied Materials 5.5 MB

Press Release: Applied Materials Unveils Chip Wiring Innovations for More Energ…

Video Animation: Endura™ Copper Barrier Seed IMS™ with Volta™ Ruthenium CVD

Blog: The Race for AI Leadership is Fueled by Materials Engineering

Blog: Beyond Backside Power: Scaling Chips to 2nm and Beyond Also Requires Fron…

Blog: Power-Hungry AI Applications Demand More Energy-Efficient Computing

Speaker Bios: 2024 SEMICON West Technology Breakfast 418.4 KB

Jun 6, 2024

BofA Securities Global Technology Conference

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May 30, 2024

Bernstein Strategic Decisions Conference

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May 16, 2024

Q2 2024 Applied Materials Earnings Conference Call

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News Release 240.2 KB

Non-GAAP Reconciliation 286.4 KB

May 2, 2024

2023 WFE Market Summary

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2023 WFE Market Summary 3 MB

2023 WFE Market Summary Key Points 2.2 MB

Mar 4, 2024

Morgan Stanley Technology, Media & Telecom Conference

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Feb 15, 2024

Q1 2024 Applied Materials Earnings Conference Call

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News Release 219.8 KB

Non-GAAP Reconciliation 290.5 KB

Feb 26, 2024

Applied Materials Panel Discussion during the SPIE Advanced Lithography + Patterning Conference 2024

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Replay of Applied Materials Panel Discussion during the SPIE Advanced Lithograp…

Applied Materials Panel Discussion during SPIE 2024 Speaker Bios

Applied Materials Expands Patterning Solutions Portfolio for Angstrom Era Chipm…

Advanced Patterning in the Angstrom Era: Challenges and Opportunities

Applied Materials News at SPIE: Investor and Media Presentation

Dec 12, 2023

Applied Materials Panel Discussion during IEDM 2023

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Charting a Course Through the Next Era of Technology Inflections

Revisiting the Future of Logic at IEDM 2023

Applied Panel during IEDM 2023 Presentation 4.1 MB

Applied Panel during IEDM 2023 Speaker Bios 565.2 KB

Jul 11, 2023

2023 SEMICON West Technology Breakfast

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2023 SEMICON West Technology Breakfast Presentation 23.1 MB

2023 SEMICON West Technology Breakfast Speaker Bios 1.1 MB

Doubling Down on Collaboration at SEMICON West 2023

A New Equipment Platform for a New Era of Chipmaking

Semiconductor Equipment and Processes Need Digital Twins

A Deeper Look into the New Vistara™ Platform

Vistara™ Semiconductor Wafer Manufacturing Platform Animation

Applied Materials’ New Vistara™ Wafer Manufacturing Platform Helps Customers Ta…

Arizona State University and Applied Materials to create ‘Materials-To-Fab’ Center At ASU Research Park 1 MB

Applied Materials Advances Heterogeneous Chip Integration with New Technologies…

Feb 28, 2023

New Ways to Shrink: Advanced Patterning Products Launch during SPIE Advanced Lithography + Patterning 2023

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Replay of the 2023 New Ways to Shrink: Advanced Patterning Products Launch

2023 New Ways to Shrink: Advanced Patterning Products Launch Speaker Bios

2023 New Ways to Shrink: Advanced Patterning Products Launch Presentation 5.9 MB

Sculpta® Press Release

VeritySEM® 10 Press Release

Bringing the Future of Advanced Patterning into Focus at SPIE

Centura® Sculpta® Animation

Centura® Sculpta® Animation Script 121.2 KB

Dec 14, 2022

eBeam Technology and Product Launch

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Applied Materials Breakthrough in Electron Beam Imaging Technology Accelerates Development of the World’s Most Advanced Computer Chips 165.2 KB

eBeam Technology and Product Presentation 8.8 MB

Bringing CFE Technology Out of the Lab and into the Fab

CFE Blog

CFE Animation

eBeam Technology and Product Presentation Replay

Sep 22, 2022

Services Master Class

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2022 Services Master Class Speaker Bios 1.6 MB

Subscription Services Provide Increased Value to Chipmakers

2022 Services Master Class Prepared Remarks 3.6 MB

2022 Services Master Class Presentation 9.1 MB

May 26, 2022

New Ways to Wire and Integrate Chips

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2022 New Ways to Wire and Integrate Chips Master Class Speaker Bios 943.9 KB

2022 New Ways to Wire and Integrate Chips Master Class Prepared Remarks 1.3 MB

2022 New Ways to Wire and Integrate Chips Master Class Presentation 13.4 MB

Ioniq Press Release 390.5 KB

Classic Moore’s Law Scaling Challenges Demand New Ways to Wire and Integrate Ch…

Apr 21, 2022

New Ways to Shrink Master Class

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2022 New Ways to Shrink Master Class Speaker Bios 1 MB

2022 New Ways to Shrink Master Prepared Remarks 2.6 MB

2022 New Ways to Shrink Master Class Presentation 9.9 MB

Replay of the 2022 New Ways to Shrink Master Class

Master Class Press Release 601.8 KB

New Ways to Shrink: Further EUV Scaling Depends on Materials Engineering and Me…

Newer Ways to Shrink

Applied Materials Technologies Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors 164.1 KB

Oct 18, 2021

2021 Process Control and AppliedPRO Master Class

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2021 Process Control and AppliedPRO Master Class Speaker Bios 336.9 KB

2021 Process Control and AppliedPRO Master Class Prepared Remarks 2.6 MB

2021 Process Control and AppliedPRO Master Class Presentation 9 MB

Replay of the 2021 Process Control and AppliedPRO Master Class

PROVision 3E Press Release 177.9 KB

Innovations in eBeam Metrology Enable a New Playbook for Patterning Control

Breakthrough in Metrology Needed for Patterning Advanced Logic and Memory Chips

Sep 8, 2021

2021 ICAPS and Packaging Master Class

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2021 ICAPS and Packaging Master Class Speakers 510.4 KB

2021 ICAPS and Packaging Master Class Prepared Remarks 3 MB

2021 ICAPS and Packaging Master Class Presentation 16.3 MB

Replay of 2021 ICAPS and Packaging Master Class

Applied Materials SiC Press Release 382.8 KB

Applied Materials Packaging Press Release 384.4 KB

The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips

Heterogeneous Design and Advanced Packaging Enable Advances in PPACt™ Even as C…

Not All Semiconductor Innovation Occurs at the Leading Edge

Jun 16, 2021

2021 Logic Master Class

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2021 Logic Master Class Speakers 625.9 KB

2021 Logic Master Class Prepared Remarks 716.1 KB

2021 Logic Master Class Presentation 13.1 MB

IMS for Interconnect Press Release 373 KB

Integrated Materials Solution Lowers Interconnect Resistance

May 5, 2021

2021 Memory Master Class

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2021 Memory Master Class Prepared Remarks 699.5 KB

2021 Memory Master Class Presentation 7.2 MB

Investor Day

Apr 6, 2021 at 8:00 AM PDT

2021 Investor Meeting

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2021 IM Customer Quotes 233.9 KB

2021 Investor Meeting 6.8 MB

2021 Investor Meeting Prepared Remarks 643.9 KB

Integrated Materials Solution Animation

Advanced Packaging Animation

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