Events

Fiscal Calendar 2023

Quarter	Fiscal Quarter End	Earnings Call
Q1	January 29	Feb 16
Q2	April 30	May 18
Q3	July 30	Projected – Aug 17
Q4	October 29	Projected – Nov 16

Events

Upcoming Events Recent Events Master Classes Investor Day

Jun 7, 2023

BofA Securities Global Technology Conference

Supporting Materials

Jul 11, 2023

2023 SEMICON West Technology Breakfast

Supporting Materials

Jun 1, 2023

Bernstein Strategic Decisions Conference

Supporting Materials

May 18, 2023

Q2 2023 Applied Material Earnings Conference Call

Supporting Materials

News Release 215.6 KB

Non-GAAP Reconciliation 379.4 KB

Mar 8, 2023

Morgan Stanley Technology, Media and Telecom Conference

Supporting Materials

Feb 16, 2023

Q1 2023 Applied Materials Earnings Conference Call

Supporting Materials

News Release 211.8 KB

Non-GAAP Reconciliations 388.5 KB

Feb 28, 2023

New Ways to Shrink: Advanced Patterning Products Launch during SPIE Advanced Lithography + Patterning 2023

Supporting Materials

Replay of the 2023 New Ways to Shrink: Advanced Patterning Products Launch

2023 New Ways to Shrink: Advanced Patterning Products Launch Speaker Bios

2023 New Ways to Shrink: Advanced Patterning Products Launch Presentation 6.8 MB

Sculpta® Press Release

VeritySEM® 10 Press Release

Bringing the Future of Advanced Patterning into Focus at SPIE

Centura® Sculpta® Animation

Centura® Sculpta® Animation Script 121.2 KB

Dec 14, 2022

eBeam Technology and Product Launch

Supporting Materials

Applied Materials Breakthrough in Electron Beam Imaging Technology Accelerates Development of the World’s Most Advanced Computer Chips 165.2 KB

eBeam Technology and Product Presentation 8.8 MB

Bringing CFE Technology Out of the Lab and into the Fab

CFE Blog

CFE Animation

eBeam Technology and Product Presentation Replay

Sep 22, 2022

Services Master Class

Supporting Materials

2022 Services Master Class Speaker Bios 1.6 MB

Subscription Services Provide Increased Value to Chipmakers

2022 Services Master Class Prepared Remarks 3.6 MB

2022 Services Master Class Presentation 9.1 MB

Replay of the 2022 Services Master Class

May 26, 2022

New Ways to Wire and Integrate Chips

Supporting Materials

Click Here to Register

2022 New Ways to Wire and Integrate Chips Master Class Speaker Bios 943.9 KB

2022 New Ways to Wire and Integrate Chips Master Class Prepared Remarks 2.8 MB

2022 New Ways to Wire and Integrate Chips Master Class Presentation 13.4 MB

Replay of the 2022 New Ways to Wire and Integrate Chips Master Class

Ioniq Press Release 390.5 KB

Classic Moore’s Law Scaling Challenges Demand New Ways to Wire and Integrate Ch…

Apr 21, 2022

New Ways to Shrink Master Class

Supporting Materials

2022 New Ways to Shrink Master Class Speaker Bios 1 MB

2022 New Ways to Shrink Master Prepared Remarks 2.6 MB

2022 New Ways to Shrink Master Class Presentation 9.9 MB

Replay of the 2022 New Ways to Shrink Master Class

Master Class Press Release 601.8 KB

New Ways to Shrink: Further EUV Scaling Depends on Materials Engineering and Me…

Newer Ways to Shrink

Applied Materials Technologies Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors 164.1 KB

Oct 18, 2021

2021 Process Control and AppliedPRO Master Class

Supporting Materials

2021 Process Control and AppliedPRO Master Class Speaker Bios 336.9 KB

2021 Process Control and AppliedPRO Master Class Prepared Remarks 2.6 MB

2021 Process Control and AppliedPRO Master Class Presentation 9 MB

Replay of the 2021 Process Control and AppliedPRO Master Class

PROVision 3E Press Release 177.9 KB

Innovations in eBeam Metrology Enable a New Playbook for Patterning Control

Breakthrough in Metrology Needed for Patterning Advanced Logic and Memory Chips

Sep 8, 2021

2021 ICAPS and Packaging Master Class

Supporting Materials

2021 ICAPS and Packaging Master Class Speakers 510.4 KB

2021 ICAPS and Packaging Master Class Prepared Remarks 3 MB

2021 ICAPS and Packaging Master Class Presentation 16.3 MB

Replay of 2021 ICAPS and Packaging Master Class

Applied Materials SiC Press Release 382.8 KB

Applied Materials Packaging Press Release 384.4 KB

The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips

Heterogeneous Design and Advanced Packaging Enable Advances in PPACt™ Even as C…

Not All Semiconductor Innovation Occurs at the Leading Edge

Jun 16, 2021

2021 Logic Master Class

Supporting Materials

2021 Logic Master Class Speakers 625.9 KB

2021 Logic Master Class Prepared Remarks 716.1 KB

2021 Logic Master Class Presentation 13.1 MB

IMS for Interconnect Press Release 373 KB

Replay of Logic Master Class

Integrated Materials Solution Lowers Interconnect Resistance

May 5, 2021

2021 Memory Master Class

Supporting Materials

Click here for webcast

2021 Memory Master Class Prepared Remarks 699.5 KB

2021 Memory Master Class Presentation 7.2 MB

Replay of Memory Master Class

Investor Day

Apr 6, 2021 at 8:00 AM PDT

2021 Investor Meeting

Supporting Materials

Click here for webcast

2021 IM Customer Quotes 233.9 KB

2021 Investor Meeting 6.8 MB

2021 Investor Meeting Prepared Remarks 643.9 KB

Integrated Materials Solution Animation

Advanced Packaging Animation

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