Events

Fiscal Calendar 2022

Quarter	Fiscal Quarter End	Earnings Call
Q1	January 30	February 16
Q2	May 1	May 19
Q3	July 31	August 18
Q4	October 30	Projected - November 17

Events

Upcoming Events Recent Events Master Classes Investor Day

Aug 18, 2022

Q3 2022 Applied Materials Earnings Conference Call

Supporting Materials

Jun 7, 2022

BofA Securities Global Technology Conference

Supporting Materials

Jun 2, 2022

Bernstein Strategic Decisions Conference

Supporting Materials

May 19, 2022

Q2 2022 Applied Materials Earnings Conference Call

Supporting Materials

Feb 16, 2022

Q1 2022 Applied Materials Earnings Conference Call

Supporting Materials

May 26, 2022

New Ways to Wire and Integrate Chips

Supporting Materials

Click Here to Register

2022 New Ways to Wire and Integrate Chips Master Class Speaker Bios 945.3 KB

2022 New Ways to Wire and Integrate Chips Master Class Prepared Remarks 2.8 MB

2022 New Ways to Wire and Integrate Chips Master Class Presentation 13.5 MB

Replay of the 2022 New Ways to Wire and Integrate Chips Master Class

Ioniq Press Release 390.5 KB

Classic Moore’s Law Scaling Challenges Demand New Ways to Wire and Integrate Ch…

Apr 21, 2022

New Ways to Shrink Master Class

Supporting Materials

2022 New Ways to Shrink Master Class Speaker Bios 1 MB

2022 New Ways to Shrink Master Prepared Remarks 2.6 MB

2022 New Ways to Shrink Master Class Presentation 9.9 MB

Replay of the 2022 New Ways to Shrink Master Class

Master Class Press Release 601.8 KB

New Ways to Shrink: Further EUV Scaling Depends on Materials Engineering and Me…

Newer Ways to Shrink

Applied Materials Technologies Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors 164.1 KB

Oct 18, 2021

2021 Process Control and AppliedPRO Master Class

Supporting Materials

2021 Process Control and AppliedPRO Master Class Speaker Bios 336.9 KB

2021 Process Control and AppliedPRO Master Class Prepared Remarks 2 MB

2021 Process Control and AppliedPRO Master Class Presentation 6.8 MB

Replay of the 2021 Process Control and AppliedPRO Master Class

PROVision 3E Press Release 177.9 KB

Innovations in eBeam Metrology Enable a New Playbook for Patterning Control

Breakthrough in Metrology Needed for Patterning Advanced Logic and Memory Chips

Sep 8, 2021

2021 ICAPS and Packaging Master Class

Supporting Materials

2021 ICAPS and Packaging Master Class Speakers 510.4 KB

2021 ICAPS and Packaging Master Class Prepared Remarks 2.2 MB

2021 ICAPS and Packaging Master Class Presentation 12.2 MB

Replay of 2021 ICAPS and Packaging Master Class

Applied Materials SiC Press Release 382.8 KB

Applied Materials Packaging Press Release 384.4 KB

The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips

Heterogeneous Design and Advanced Packaging Enable Advances in PPACt™ Even as C…

Not All Semiconductor Innovation Occurs at the Leading Edge

Jun 16, 2021

2021 Logic Master Class

Supporting Materials

2021 Logic Master Class Speakers 625.9 KB

2021 Logic Master Class Prepared Remarks 536.3 KB

2021 Logic Master Class Presentation 9.8 MB

IMS for Interconnect Press Release 373 KB

Replay of Logic Master Class

Integrated Materials Solution Lowers Interconnect Resistance

May 5, 2021

2021 Memory Master Class

Supporting Materials

Click here for webcast

2021 Memory Master Class Prepared Remarks 524.1 KB

2021 Memory Master Class Presentation 5.4 MB

Replay of Memory Master Class

Investor Day

Apr 6, 2021 at 8:00 AM PDT

2021 Investor Meeting

Supporting Materials

Click here for webcast

2021 IM Customer Quotes 233.9 KB

2021 Investor Meeting 6.8 MB

2021 Investor Meeting Prepared Remarks 643.9 KB

Integrated Materials Solution Animation

Advanced Packaging Animation

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