Events

Fiscal Calendar 2026

Quarter	Fiscal Quarter End	Earnings Call
Q1	January 25	February 12
Q2	April 26	Projected - May 14
Q3	July 26	Projected - August 13
Q4	October 25	Projected - November 12

Events

Upcoming Events Recent Events Master Classes

There are currently no events scheduled.

Mar 10, 2026

Cantor Fitzgerald Global Technology & Industrial Growth Conference

Supporting Materials

Mar 2, 2026

Morgan Stanley Technology, Media & Telecom Conference

Supporting Materials

Feb 24, 2026

Applied Materials at SPIE Advanced Lithography + Patterning Conference 2026

Supporting Materials

Applied Materials Market and Product Briefing 5.4 MB

Feb 12, 2026

Q1 2026 Applied Materials Earnings Conference Call

Supporting Materials

Q126 News Release 249.7 KB

Q126 Non-GAAP Reconciliation 282.5 KB

Dec 2, 2025

UBS Global Technology and AI Conference

Supporting Materials

Nov 13, 2025

Q4 2025 Applied Materials Earnings Conference Call

Supporting Materials

Q425 News Release 271.1 KB

Q425 Non-GAAP Reconciliation 283.6 KB

Apr 8, 2026

2026 Logic Master Class

Supporting Materials

2026 Logic Master Class Speaker Bios 331.1 KB

2026 Logic Master Class Prepared Remarks 2.4 MB

2026 Logic Master Class Presentation 8.1 MB

2026 Logic Master Class Product Press Release 198.2 KB

2026 Logic Master Class Replay

Feb 24, 2026

Applied Materials at SPIE Advanced Lithography + Patterning Conference 2026

Supporting Materials

Applied Materials Market and Product Briefing 5.4 MB

Oct 7, 2025

2025 SEMICON West Technology Breakfast

Supporting Materials

Presentation: Applied Materials 14.9 MB

Press Release: Applied Materials Unveils Next-Gen Chipmaking Products to Superc…

Key Points: Applied Materials 11.7 MB

Feb 24, 2025

Applied Materials Panel Discussion during SPIE 2025

Supporting Materials

Click here to register

Presentation: Applied Materials SEMVision H20 Overview 2.8 MB

Press Release: Applied Materials Accelerates Chip Defect Review with Next-Gen eBeam System 102.2 KB

Jul 9, 2024

2024 SEMICON West Technology Breakfast

Supporting Materials

Presentation: Applied Materials 9.6 MB

Key Points: Applied Materials 5.5 MB

Press Release: Applied Materials Unveils Chip Wiring Innovations for More Energ…

Video Animation: Endura™ Copper Barrier Seed IMS™ with Volta™ Ruthenium CVD

Blog: The Race for AI Leadership is Fueled by Materials Engineering

Blog: Beyond Backside Power: Scaling Chips to 2nm and Beyond Also Requires Fron…

Blog: Power-Hungry AI Applications Demand More Energy-Efficient Computing

Speaker Bios: 2024 SEMICON West Technology Breakfast 418.4 KB

May 2, 2024

2023 WFE Market Summary

Supporting Materials

2023 WFE Market Summary 3 MB

2023 WFE Market Summary Key Points 2.2 MB

Feb 26, 2024

Applied Materials Panel Discussion during the SPIE Advanced Lithography + Patterning Conference 2024

Supporting Materials

Replay of Applied Materials Panel Discussion during the SPIE Advanced Lithograp…

Applied Materials Panel Discussion during SPIE 2024 Speaker Bios

Applied Materials Expands Patterning Solutions Portfolio for Angstrom Era Chipm…

Advanced Patterning in the Angstrom Era: Challenges and Opportunities

Applied Materials News at SPIE: Investor and Media Presentation

Dec 12, 2023

Applied Materials Panel Discussion during IEDM 2023

Supporting Materials

Charting a Course Through the Next Era of Technology Inflections

Revisiting the Future of Logic at IEDM 2023

Applied Panel during IEDM 2023 Presentation 4.1 MB

Applied Panel during IEDM 2023 Speaker Bios 565.2 KB

Jul 11, 2023

2023 SEMICON West Technology Breakfast

Supporting Materials

2023 SEMICON West Technology Breakfast Presentation 23.1 MB

2023 SEMICON West Technology Breakfast Speaker Bios 1.1 MB

Doubling Down on Collaboration at SEMICON West 2023

A New Equipment Platform for a New Era of Chipmaking

Semiconductor Equipment and Processes Need Digital Twins

A Deeper Look into the New Vistara™ Platform

Vistara™ Semiconductor Wafer Manufacturing Platform Animation

Applied Materials’ New Vistara™ Wafer Manufacturing Platform Helps Customers Ta…

Arizona State University and Applied Materials to create ‘Materials-To-Fab’ Center At ASU Research Park 1 MB

Applied Materials Advances Heterogeneous Chip Integration with New Technologies…

Feb 28, 2023

New Ways to Shrink: Advanced Patterning Products Launch during SPIE Advanced Lithography + Patterning 2023

Supporting Materials

2023 New Ways to Shrink: Advanced Patterning Products Launch Speaker Bios

2023 New Ways to Shrink: Advanced Patterning Products Launch Presentation 5.9 MB

Sculpta® Press Release

VeritySEM® 10 Press Release

Bringing the Future of Advanced Patterning into Focus at SPIE

Centura® Sculpta® Animation

Centura® Sculpta® Animation Script 121.2 KB

Dec 14, 2022

eBeam Technology and Product Launch

Supporting Materials

Applied Materials Breakthrough in Electron Beam Imaging Technology Accelerates Development of the World’s Most Advanced Computer Chips 165.2 KB

eBeam Technology and Product Presentation 8.8 MB

Bringing CFE Technology Out of the Lab and into the Fab

CFE Blog

CFE Animation

Sep 22, 2022

Services Master Class

Supporting Materials

2022 Services Master Class Speaker Bios 1.6 MB

Subscription Services Provide Increased Value to Chipmakers

2022 Services Master Class Prepared Remarks 3.6 MB

2022 Services Master Class Presentation 9.1 MB

Apr 21, 2022

New Ways to Shrink Master Class

Supporting Materials

2022 New Ways to Shrink Master Class Speaker Bios 1 MB

2022 New Ways to Shrink Master Prepared Remarks 2.6 MB

2022 New Ways to Shrink Master Class Presentation 9.9 MB

Master Class Press Release 601.8 KB

New Ways to Shrink: Further EUV Scaling Depends on Materials Engineering and Me…

Newer Ways to Shrink

Applied Materials Technologies Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors 164.1 KB

Oct 18, 2021

2021 Process Control and AppliedPRO Master Class

Supporting Materials

2021 Process Control and AppliedPRO Master Class Speaker Bios 336.9 KB

2021 Process Control and AppliedPRO Master Class Prepared Remarks 2.6 MB

2021 Process Control and AppliedPRO Master Class Presentation 9 MB

PROVision 3E Press Release 177.9 KB

Innovations in eBeam Metrology Enable a New Playbook for Patterning Control

Breakthrough in Metrology Needed for Patterning Advanced Logic and Memory Chips

Sep 8, 2021

2021 ICAPS and Packaging Master Class

Supporting Materials

2021 ICAPS and Packaging Master Class Speakers 510.4 KB

2021 ICAPS and Packaging Master Class Prepared Remarks 3 MB

2021 ICAPS and Packaging Master Class Presentation 16.3 MB

Applied Materials SiC Press Release 382.8 KB

Applied Materials Packaging Press Release 384.4 KB

The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips

Heterogeneous Design and Advanced Packaging Enable Advances in PPACt™ Even as C…

Not All Semiconductor Innovation Occurs at the Leading Edge

May 5, 2021

2021 Memory Master Class

Supporting Materials

2021 Memory Master Class Prepared Remarks 699.5 KB

2021 Memory Master Class Presentation 7.2 MB

Investor Day

More events are coming soon.

Follow Us